Scope The project aims to develop photonic IC test modules with functionalities for variety of application areas. The modules contain functional elements (or building blocks or IP blocks) including lasers, modulators, filters, spectrometers, and switches. These modules are called Bright-BoardsTM, in analogy to electronic breadboards. The boards enable a much faster path for prototyping by

Scope The project aims to develop scalable, and therefore cost-efficient, assembly packaging technology for integrated photonic chips. This packaging technology comprises a high-density electrical interconnect and pluggable optical interconnect, efficient and scalable manufacturing processes as well as improved thermal management. Main result achieved CITC has developed an ultra-low loss optical interconnect, which is under patent

Scope The projects aim to develop reference chips for micro-transfer printing technology supporting scalable integration and improved heat sinking and coupling efficiency and to integrate P laser/amplifiers onto imec’s 200mm SiPho platform. Main result achieved imec VZW has begun to set up its pilot line for micro- transfer printing on 200mm wafers with an extension

Scope: The project aims to develop TriPleX building blocks for application domains, develop new coatings for reconfigurable photonic chips, further develop the hybrid integration of TriPleX with other photonic platforms and scale up the high-yield process towards medium volume production. Main result achieved: LioniX has collaborated with the University of Twente to develop three ultra-low-loss

Scope: The project aims to develop PIC-based product manufacturingcapabilities for next-gen fibre sensing products and further developpackaging and testing services for third parties. Main result achieved: PhotonFirst has developed a market-driven photonic sensing platform that has been successfully integrated into several industrial processes, providing real-time monitoring and optimisation capabilities.

Scope: The Industrialisation of the SiN Platform involves investments in the equipment necessary to establish the experimental infrastructure for silicon nitride fabrication. This phase includes investments for the construction and setup of the facility, the purchase and installation of all required equipment, and the acquisition of any licenses for manufacturing processes. This will create an

Scope: PHIX seeks collaboration with PITC and Taiwanese parties, ITRI and BizLink. Through this project, PHIX and PITC aim to strengthen ties with the Taiwanese photonics community, develop bilateral agreements to support cooperation, and create new processes for assembling and packaging photonic integrated circuits, thereby expanding their product and service portfolio. The project focuses on

Projects: Building up the shared photonic labFast and high-volume integration processesExternal cavity lasersOWC/LiDAR applicationsPackaging and assembly (panel-level integration) Scope: The projects’ aim is to establish a 200 m2 photonic characterisation lab at the High Tech campus in Eindhoven, to leverage and upgrade equipment for the full integration process(es) and component transfer, design and develop InP/SiN

Project Overview The Photonic Integration Technology Center (PITC)—a joint initiative by TNO, TU/e, the University of Twente, and PhotonDelta—conducts foundational work to strengthen the Dutch silicon nitride (SiN) photonics ecosystem. Phase 1 of the PITC SiN programme runs from January 2023 to December 2025 and focuses on expanding technical capabilities, infrastructure, and personnel required to